Boschman Technologies is the worlds leading supplier of automatic molding systems using Film Assisted Molding (FAM) technology. QFN, SENSOR, MEMS and other unique applications where bond pads, heat sinks, window or exposed die surfaces must be kept free of mold compound or resin bleed are ideally suited for our cost effective technology. As the holder of many FAM related patents, Boschman brings unique and proven solutions.  In addition Boschman provides automatic molding solutions for conventional semiconductor devices and reel to reel smartcards.

Stenograaf 3
6921 EX Duiven
The Netherlands

phone: 0031 263 194900
fax: 0031 263 194999
email: info@boschman.nl
website: http://www.boschman.nl